Kuala Lumpur Stock Exchange Listing 19 November 2003
 




Engineering Services

 
  • Fast turnaround prototypes and pilot run
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  • PCB Panel Layout design
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  • Test Development


  • Manufacturing Capability

     
  • SMT capability from 1005(0402) chips up to 50x50mm, QFP 0.50mm pitch including     all types of odd shape components. Solder and glue processes.
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  • Laser section Microscope Measuring Facilities
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  • Visual Inspection
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  • Axial Auto-Insertion
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  • Radial Auto-Insertion
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  • Manual Insertion ( Convention soldering ( with Lead ), and Lead Free Soldering )
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  • Ultrasonic welding process
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  • ICT Testers
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  • FCT Testers (custom made)
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  • RF Tuning and Testing (Shield Room)
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  • Casing Assembly
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  • Complete Product Assembly
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  • Complete Product Testing
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  • Withstanding and Insulation Tester (Hipot)
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  • Chamber


  • Project Management and Material Management Services

     
  • Customer Focused Project Management
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  • Turnkey or Consigned Manufacturing
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  • Flexibility in High Mix Low Volume Project, Batch Order
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  • Material ordering and management system
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  • Extensive network of component suppliers globally
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  • Packing and Shipping to any destination (drop ship)